U.S. federal trademark · Serial No. 77041032 · Reg. No. 3451884
Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benotriazole (BTA), and L-Proline solution
Chemical mechanical polishing (CMP) slurry and Chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the opto-electronics and photonics industries; Chemical mechanical polishing slurry for Liquid Crystal Display (LCD), Organic Light Emitting Diodes (O-LED), Light Emitting Diode (LED), Glass Thinning, and Hard Disk; Abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Cleaner for use in electronics industry; Pad cleaning solution for use in the manufacturing and processing of semiconductors; Post-Copper chemical mechanical planarization (CMP) cleaning solution for use in the manufacturing and processing of semiconductors; Cleaning solution for processing of Integrated Circuit (IC) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors
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