Glass-fiber-reinforced epoxy molding compound for the encapsulation of electrical and electronic components for high performance military applications; fast curing mineral-filled epoxy molding compound for use in the encapsulation of electrical and electronic components for high performance aeronautical and nautical applications and military applications

'aeronaut':42 'applic':20,45,48 'compon':15,38 'compound':7,28 'cure':22 'electr':12,35 'electron':14,37 'encapsul':10,33 'epoxi':5,26 'fast':21 'fiber':3 'fill':25 'glass':2 'glass-fiber-reinforc':1 'high':17,40 'militari':19,47 'miner':24 'mineral-fil':23 'mold':6,27 'nautic':44 'perform':18,41 'reinforc':4 'use':30

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