U.S. federal trademark · Serial No. 86446449 · Reg. No. 4967888
coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards; dry film photosensitive polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods; dry film thermosetting polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods
insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; coverlay film for use with flexible printed circuits; insulating resin materials for dry film type for use on flexible printed boards
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.