Processing of semiconductor wafers; rental of semiconductor wafer manufacturing machines and systems

'machin':10 'manufactur':9 'process':1 'rental':5 'semiconductor':3,7 'system':12 'wafer':4,8

Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalworking machine tools; glassware manufacturing machines, namely, glass-working machines and glaziers' diamond; semiconductor manufacturing machines and systems composed of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; apparatus in the nature of a machine for surface protection processing of semiconductor wafers; apparatus in the nature of a machine for surface protection processing of electronic components

'apparatus':47,61 'clean':45 'compon':74 'compos':29 'cut':4 'deioniz':39 'diamond':23 'dice':33 'electron':73 'glass':18 'glass-work':17 'glasswar':13 'glazier':22 'grind':6,37 'machin':2,5,7,9,11,15,20,26,34,38,53,67 'manufactur':14,25 'metalwork':1,10 'name':3,16 'natur':50,64 'polish':8 'process':57,71 'protect':56,70 'recycl':41 'semiconductor':24,31,35,44,59 'surfac':55,69 'system':28 'tool':12 'unit':42,46 'wafer':32,36,60 'water':40 'work':19

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