U.S. federal trademark · Serial No. 78786208 · Reg. No. 3320923
microelectronic packages and package components, namely lids and covers; semiconductor integrated circuit chip carriers and housings
contract manufacturing services in the field of microelectronic packaging; soldering and soldering reflow services in the field of electronics
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.