U.S. federal trademark · Serial No. 99857672
Evaporative cooling apparatus for high-density computer processors; liquid-to-chip refrigerant-based thermal management systems for server racks; heat exchangers, namely, saturated vapor conduits integrated with direct-current power busbars for cooling semiconductor devices in data centers.
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.