U.S. federal trademark · Serial No. 98846302 · Reg. No. 7879569
Die attachment equipment for manufacturing semiconductor, namely, dies for use with machine tools; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; die bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; electronic components placement machines and apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; semiconductor chip mounting equipment in the nature of semiconductor manufacturing machines; semiconductor package electromagnetic shielding equipment in the nature of semiconductor manufacturing machines; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.