Machines for processing materials, namely, metal cutting machines; machines for processing semiconductor materials, namely, wafers; semiconductor wafer cutting machines; machines for producing microchips, namely, machines for laser surface treatment of materials for severing silicon wafers or other crystalline materials for semi-conductor devices into microchips

'conductor':43 'crystallin':38 'cut':7,18 'devic':44 'laser':27 'machin':1,8,9,19,20,25 'materi':4,13,31,39 'metal':6 'microchip':23,46 'name':5,14,24 'process':3,11 'produc':22 'semi':42 'semi-conductor':41 'semiconductor':12,16 'sever':33 'silicon':34 'surfac':28 'treatment':29 'wafer':15,17,35

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