Electric welding machines that attach chips and electronic components to the substrate using ultrasonic vibration; ultrasonic welding heads in the nature of machines parts for electric welding machines that operate using ultrasonic vibration; electric welding machines that use thermosonic bonding to attach chips and electronic components to the substrate; welding and soldering equipment, namely, welding electrodes; machines for the assembly of semiconductor components; memory chip manufacturing machines; machines for the production of semiconductors; semiconductor wafer processing equipment; bonding machines in the nature of machines that mount a chip

'assembl':60 'attach':5,42 'bond':40,78 'chip':6,43,65,88 'compon':9,46,63 'electr':1,26,34 'electrod':56 'electron':8,45 'equip':53,77 'head':18 'machin':3,23,28,36,57,67,68,79,84 'manufactur':66 'memori':64 'mount':86 'name':54 'natur':21,82 'oper':30 'part':24 'process':76 'product':71 'semiconductor':62,73,74 'solder':52 'substrat':12,49 'thermoson':39 'ultrason':14,16,32 'use':13,31,38 'vibrat':15,33 'wafer':75 'weld':2,17,27,35,50,55

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