U.S. federal trademark · Serial No. 75406280 · Reg. No. 2494608
HEAT DISSIPATION COMPONENTS FOR COMPUTERS AND ELECTRONICS, NAMELY, HEAT SINKS FOR USE WITH MICROPROCESSORS, INTEGRATED CIRCUITS, AND APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)
ENGINEERING SERVICES NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES AND HEAT DISSIPATION SYSTEMS FOR OTHERS
CUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS
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