U.S. federal trademark · Serial No. 75562304 · Reg. No. 2287948
[ pre-molded lead frames for the electronic, semiconductor and telecommunications industries ]
stamping, molding, soldering, wire bonding, and electroplating of metals, namely, nickel, gold, tin-lead, lead, tin and silver for the electronic, semiconductor, telecommunications and automotive industries
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.