U.S. federal trademark · Serial No. 79434587 · Reg. No. 8299871
Semiconductor manufacturing machines; parts of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts of laminated semiconductor chip manufacturing machines; semiconductor manufacturing machine parts, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp)
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.