Trademark Search  /  HIGH DENSITY VIA PATTERN (HDVP)

HIGH DENSITY VIA PATTERN (HDVP)

○ Dead · Abandoned

U.S. federal trademark · Serial No. 88771443

Mark
HIGH DENSITY VIA PATTERN (HDVP)
Status
Abandoned
Serial Number
88771443
Filing Date
January 23, 2020
Class(es)
Class 009, Class 040

Owner

TTM Technologies, Inc.
03 · Costa Mesa, CA, US

Goods & Services

Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others

Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.