adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry

'adhes':1,10,25,58,89 'applic':83 'artifici':60,91 'assembl':29 'attach':82 'bond':70 'coat':72 'compon':45 'conduct':9 'electron':5,14,22,34,38,44,86,104 'encapsul':73 'epoxi':17,48,55,67,98 'filler':40 'heatproof':79 'industri':6,15,23,24,39,57,87,88,105 'joint':81 'mainten':30 'moistur':77 'mold':75 'name':46 'non':8 'non-conduct':7 'proof':78 'repair':32 'resin':18,49,56,61,64,68,92,95,99 'seal':74 'solder':80 'synthet':63,94 'underfil':53 'unprocess':16,47,54,59,62,66,90,93,97 'use':3,12,20,26,36,42,51,101 'waterproof':76 'wetproof':71

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