U.S. federal trademark · Serial No. 88049337 · Reg. No. 5917799
[Integrated circuits; heterogeneously integrated circuits, microwave integrated circuits, monolithic microwave integrated circuits (MMICs); metal-embedded chip assembly in the nature of semiconductor chip sets; power amplifier monolithic microwave integrated circuits (MMICs); micro-electrical-mechanical devices (MEMs); laser systems comprising lasers, not for medical purposes; computer hardware and software for ultrasonic evaluation of solid and liquid parts and materials; optically controlled phased array radars, microwave antennas, laser radar, and antennas]
Scientific research and development in the fields of information sciences, systems sciences, materials, microsystems, microfabrication, sensors and electronics, namely, complex networks, cyber-physical resilience, brain-machine intelligence, silicon MEMS (micro-electrical-mechanical devices), quartz MEMS, nonlinear mechanics, architected materials, metallurgy, ceramics, scalable nanotechnology, polymer coatings, epitaxial growth, thin-film deposition, photolithography, electron beam lithography, wet/dry etching, heterogeneous integration, metrology testing, electrical testing, radio-frequency (RF), millimeter-wave subsystems, electro-optical sensor subsystems, applied electromagnetics, infrared imaging, integrated photonics, RF GaN (gallium nitride) MMICs (monolithic microwave integrated circuits), and nanoscale devices
Foundry services, namely, custom manufacturing and assembly of semiconductor devices; custom manufacturing and assembly of monolithic microwave integrated circuits (MMICs); custom manufacturing services, namely, metal-embedded chip assembly; surface treatment of semiconductor wafers by epitaxial growth; surface treatment of semiconductor wafers by vapor deposition for forming thin films; optical lithography onto substrates; electron beam lithography onto substrates; etching treatments for integrated circuits; integrated circuit singulation in the nature of cutting and dicing of wafers to produce integrated circuits; integrated circuit assembly
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.