Trademark Search  /  HSP

HSP

○ Dead · Abandoned

U.S. federal trademark · Serial No. 90877083

Mark
HSP
Status
Abandoned
Serial Number
90877083
Filing Date
August 11, 2021
Class(es)
Class 001, Class 002, Class 017

Owners

TAIYO HOLDINGS CO., LTD.
03 · Saitama, JP
TAIYO HOLDINGS CO., LTD.
03 · Saitama, JP

Goods & Services

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials

Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink

Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.