HY-BOND

○ Dead · Cancelled

U.S. federal trademark · Serial No. 74425256 · Reg. No. 1840278

Mark

HY-BOND

Status

Cancelled

Serial Number

74425256

Registration No.

1840278

Filing Date

August 16, 1993

Registration Date

June 21, 1994

Class(es)

Class 005

Owners

03 · Higashiyama-ku, Kyoto 605, JP

03 · Higashiyama-ku, Kyoto 605, JP

03 · Higashiyama-ku, Kyoto 605, JP

dental cement for bonding purposes

Thinking of using a similar name?

Search 14 million+ trademarks free and see if your brand conflicts with "HY-BOND" or anything like it, before you file.

Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.