HY-BOND

○ Dead · Abandoned

U.S. federal trademark · Serial No. 76556100

Mark

HY-BOND

Status

Abandoned

Serial Number

76556100

Filing Date

October 16, 2003

Class(es)

Class 005

Owner

03 · Higashiyama-ku, Kyoto 605, JP

Dental Material-namely, Dental Cement for Bonding Purposes

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.