HY-BOND

● Live · Registered

U.S. federal trademark · Serial No. 78641278 · Reg. No. 3095467

Mark

HY-BOND

Status

Registered

Serial Number

78641278

Registration No.

3095467

Filing Date

June 1, 2005

Registration Date

May 23, 2006

Class(es)

Class 005

Owners

03 · KYOTO, JP

03 · Kyoto 605, JP

03 · Kyoto 605, JP

DENTAL CEMENT

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.