packages for use in semiconductor devices and parts therefor, namely, integrated circuit assemblies having a semiconductor element(s) which is connected to a conductive circuit(s) and sealed; integrated circuits, automated bonding tapes, leadframes, glass-to-metal seals, hermetic seal headers and ceramic packages for integrated circuit assemblies and optoelectronic assemblies

'assembl':13,49,52 'autom':31 'bond':32 'ceram':44 'circuit':12,25,30,48 'conduct':24 'connect':21 'devic':6 'element':17 'glass':36 'glass-to-met':35 'header':42 'hermet':40 'integr':11,29,47 'leadfram':34 'metal':38 'name':10 'optoelectron':51 'packag':1,45 'part':8 'seal':28,39,41 'semiconductor':5,16 'tape':33 'therefor':9 'use':3

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