HYSOL

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RESIN BASED FABRICATING AND PATCHING MATERIALS, INCLUDING TWO-COMPONENT POLYMERIZABLE PATCHING MATERIAL FOR PLYWOOD AND THE LIKE, MULTICOMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS, AND MOLDABLE CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD

RESIN BASE ADHESIVE COMPOSITIONS, INCLUDING ADHESIVE SEALANTS OR COATINGS OF THE THERMOSETTING RESIN TYPE HAVING A CHARACTERISTIC GREEN STRENGTH AND ADHESIVE SEALANTS AND COATINGS OF THE THERMOSETTING TYPE SUPPLIED IN LIQUID, PASTE, AND SHEET OR TAPE FORM

ELECTRICAL INSULATING MATERIALS-NAMELY, THERMOSETTING RESINS USED AS ELECTRICAL INSULATING MATERIALS; EPOXY COMPOUNDS FOR POTTING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; THERMOSETTING POWDERS APPLIED TO PREHEATED OBJECTS BY DUSTING, BY DRY SPRAY PROCESSES AND BY FLUIDIZED BED PROCESSES; AND CLAMP-ON CASES AND RESIN FILLED CASES FOR IN-LINE, BRANCHED, AND BUTT SPLICES AND TERMINAL ENDS OF ELECTRICAL WIRES AND CABLES

THERMOSETTING PLASTIC MATERIALS, E.G. IN THE FORM OF SHEETS, RODS AND TUBES, POWDERS AND LIQUIDS, EPOXY COMPOUNDS FOR POTTING OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS, MULTICOMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS, AND MOLDABLE SYNTHETIC CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD

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