THERMOSETTING PLASTIC MATERIALS, E.G., IN THE FORM OF POWDERS AND LIQUIDS; EPOXY COMPOUNDS FOR POTTING OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; MULTI-COMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS; AND MOLDABLE SYNTHETIC CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD; RESIN BASE ADHESIVE COMPOSITIONS-NAMELY, ADHESIVE SEALANTS AND COATINGS; AND CONDUCTIVE CEMENTS AND ADHESIVE COATINGS

'adhes':53,57,65 'applic':33 'base':52 'cement':63 'clay':38 'clay-lik':37 'coat':18,60,66 'compon':21,24 'composit':55 'compositions-nam':54 'compound':13 'conduct':62 'densiti':29 'e.g':4 'electr':20 'epoxi':12 'form':7 'like':39,49 'liquid':11 'low':28 'materi':3,40 'moldabl':35 'multi':23 'multi-compon':22 'name':56 'plastic':2 'pot':15 'powder':9 'protect':17 'resin':26,51 'sealant':58 'set':41 'solid':44 'structur':32 'synthet':36 'thermoset':1,25 'tool':30 'wood':50 'work':48

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