Trademark Search  /  IN-PACKAGE OPTICS

IN-PACKAGE OPTICS

○ Dead · Abandoned

U.S. federal trademark · Serial No. 88013840

Mark
IN-PACKAGE OPTICS
Status
Abandoned
Serial Number
88013840
Filing Date
June 25, 2018
Class(es)
Class 009, Class 042

Owner

Rockley Photonics Limited
13 · London, GB

Goods & Services

Optical sensors; LiDAR (Light Detection and Ranging) sensors; spectrometers; spectrographs; optical phased arrays (OPAs); optical transmitters and receivers; apparatus for the recording, transmission or reproduction of sound, images and data; microprocessors; telecommunications switches; data switches; data centre switches; routing switches; unified fabric switches; optical switches; opto-electronic switches; optical modulators; passive optical components; optical multiplexers and demultiplexers; optical interconnects; integrated optical devices; integrated optical modules; integrated optical/electronic modules; computer chips; computer chipsets; photonic chips; photonic chipsets; silicon photonic chips; silicon photonic chipsets; hybrid optical/electronic chips; hybrid optical/electronic circuits; integrated circuits computer chipsets; laser diodes; photodetectors; avalanche photodetectors; parts and fittings for all the aforesaid goods

Custom design, design, and development of computer hardware, electronic telecommunications apparatus and instruments, optical apparatus and instruments, optical communication apparatus and instruments, optical sensors, LiDAR (Light Detection and Ranging) sensors, spectrometers, spectrographs, optical phased arrays (OPAs), apparatus for the recording, transmission or reproduction of sound, images and data, computer networks, microprocessors, telecommunications switches, data switches, data centre switches, routing switches, unified fabric switches, optical switches, opto-electronic switches, optical modulators, passive optical components, optical multiplexers and demultiplexers, optical interconnects, integrated optical devices, integrated optical modules, integrated optical/electronic modules, computer chips, computer chipsets, photonic chips, photonic chipsets, silicon photonic chips, silicon photonic chipsets, hybrid optical/electronic chips, hybrid optical/electronic circuits, integrated circuits computer chipsets, lasers, photodetectors, avalanche photodetectors; consultancy, testing, research, and advisory services, all relating to the design and development of computer hardware, electronic telecommunications apparatus and instruments, optical apparatus and instruments, optical communication apparatus and instruments, optical sensors, LiDAR (Light Detection and Ranging) sensors, spectrometers, spectrographs, optical phased arrays (OPAs), apparatus for the recording, transmission or reproduction of sound, images and data, computer networks, microprocessors, telecommunications switches, data switches, data centre switches, routing switches, unified fabric switches, optical switches, opto-electronic switches, optical modulators, passive optical components, optical multiplexers and demultiplexers, optical interconnects, integrated optical devices, integrated optical modules, integrated optical/electronic modules, computer chips, computer chipsets, photonic chips, photonic chipsets, silicon photonic chips, silicon photonic chipsets, hybrid optical/electronic chips, hybrid optical/electronic circuits, integrated circuits computer chipsets, lasers, photodetectors, avalanche photodetectors; technical support services, namely, providing technical advice and consultation in the field of photonic chips and silicon photonic chips

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.