U.S. federal trademark · Serial No. 86948896 · Reg. No. 5370718
Mechanically compliant and durable pads or films that are thermally conductive, namely, vertically aligned carbon nanotube arrays in a polymer matrix supported by metal foil used as thermal or electrical interface materials for semiconductor chip testing, adhered between and sold as a component of a heat sink and heat source for use in a heat transfer apparatus
Mechanically compliant and durable pads or films that are thermally conductive, namely, vertically aligned carbon nanotube arrays in a polymer matrix supported by metal foil used as thermal or electrical interface materials in the nature of tubular carbon molecules used in electronic and mechanical applications, in particular semiconductor chip testing and heat sink and heat source applications for use in electronic components
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.