Material testing instruments and machines for testing electronics, namely, semiconductor wafers, circuit boards, lead frames; electronic testing apparatus, not for medical purposes, for testing electrical bonds for presence, adhesion, strength, and mode of failure; semiconductor testing apparatus; semiconductor detectors, namely, bond-testing inspection apparatuses for destructive and non-destructive testing of electronic components to determine bond integrity

'adhes':29 'apparatus':18,37,45 'board':13 'bond':26,42,58 'bond-test':41 'circuit':12 'compon':55 'destruct':47,51 'detector':39 'determin':57 'electr':25 'electron':8,16,54 'failur':34 'frame':15 'inspect':44 'instrument':3 'integr':59 'lead':14 'machin':5 'materi':1 'medic':21 'mode':32 'name':9,40 'non':50 'non-destruct':49 'presenc':28 'purpos':22 'semiconductor':10,35,38 'strength':30 'test':2,7,17,24,36,43,52 'wafer':11

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