U.S. federal trademark · Serial No. 99559690
Design, development and manufacturing of nanoscale three-dimensional optical components, devices and systems; fabrication by lithography of microlenses, metalenses, gradient-index (grin) optics, planar optics, lens arrays and printed optics on fiber tips; provision of lithography systems, automated lithography and optical metrology hardware and software; and provision of custom optical design, inverse-design, prototyping, and contract manufacturing services for optics and photonics
Custom assembly of photonic and optic devices and its structural components in specific applications and modules; custom assembly services concerning photonic devices and instruments for and on behalf of third parties; custom photonic manufacturing services in the field of photonic and optic components and devices, particularly integrated circuits, photonic integrated circuits; hybrid multi-chip assembly and integration, namely, custom hybrid multi-chip assembly and heterogenous integration subassembly of photonic chips and multi-chips for others; fiber placement and photonic wire bonding on products of others, namely, custom manufacture of photonics; custom manufacturing of fiber arrays; custom assembling of optical fiber arrays for photonic integrated circuits,; custom assembly services concerning semiconductors, photonic chips, integrated circuits, and photonic integrated circuits, for the following industries, telecommunications, sensing, imaging and display, and computation
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.