U.S. federal trademark · Serial No. 76552662 · Reg. No. 3252640
Electronic components, namely microelectronic packages featuring semiconductor integrated circuit die for use in high density and three-dimensional electronic modules and laser and infrared imaging devices, namely electronic assemblies for use with focal plane arrays and LADAR devices
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.