U.S. federal trademark · Serial No. 79260171 · Reg. No. 5940894
Chemicals for use in metal plating; metal plating chemical compositions; chemical compositions for metal plating; chemical compositions for nickel plating; chemical compositions for zinc plating; stripping chemicals for removing metal films in the electronics industry; lead-free plating chemicals; wafer bump plating chemicals; chemicals for use in industry; antistatic chemicals for industrial purposes; antistatic preparations, other than for household purposes; separating and unsticking preparations in the nature of solvents for use in the electronics industry
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.