U.S. federal trademark · Serial No. 76183350 · Reg. No. 2923600
Providing a database of consumer information regarding products and services available for assembly of semiconductors; providing on-line retail electronic commerce services, namely, on-line catalog for selection, ordering and payment of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment and tools, dicing equipment and blades, factory automation products and services, substrate technology services, manual wire bonding equipment, tools and materials, package singulation equipment and blades, solder ball placement equipment, wafer bumping equipment, tools and materials, wafer bumping services, wafer preparation equipment, wafer test products and package test products, all in the field of back-end assembly of semiconductors; on-line customer-specific business consulting services for supply, logistics and support, all in the field of back-end assembly of semiconductors
On-line customer-specific technical consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plans to enhance overall yields and reduce cycle times, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites, all in the field of back-end assembly of semiconductors; on-line customer-specific product design in the field of back-end assembly of semiconductors
On-line training services for others in the field of back-end assembly of semiconductors
On-line refurbishment of equipment for others in the field of back-end assembly of semiconductors
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.