U.S. federal trademark · Serial No. 88269341
Semiconductors; semiconductor chips; semiconductor devices; integrated circuit modules; chip carriers, namely, semiconductor chip housings
Ceramic substrates for electrical or thermal insulation used in the manufacture of semiconductors, semiconductor chips, semiconductor devices, integrated circuit modules, and chip carriers, namely, semiconductor chip housings
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.