U.S. federal trademark · Serial No. 88100270 · Reg. No. 5744387
Integrated circuit modules; electronic integrated circuits; circuit boards provided with integrated circuits; semiconductor chips; computer chips; integrated circuit modules for use with infrared detectors; chip carriers, namely, semiconductor chip housings; integrated circuits; photoelectric sensors; infrared sensors
CMOS image sensor packaging in the nature of integrated circuit assembly; semiconductor packaging in the nature of integrated circuit assembly; manufacturing processing of semiconductors, wafers, and integrated circuits for others; assembly of semiconductors, wafers, and integrated circuits for others; packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; metal laminating; laminating of plastic, metal, ceramic or glass sheets; laminating of plastic sheets; molding of plastic materials
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.