Machines for printing, patterning, additive patterning, digital printing, masking, stamping, embossing, subtractive patterning, digital photo-patterning; machinery for manufacturing electronic components, semiconductor components, devices, and systems; semiconductor manufacturing machines; chip packaging machines for electronic components, semiconductor components, devices, and systems; power-operated machine tools for stamping and embossing; power-operated machines, namely, extrusion coaters, spin coaters, spray coaters and vapor coaters; power-operated fluidic dispensing machines for ink delivery and for manufacturing electronic components, semiconductor components, devices, and systems; power-operated spin coating machines for manufacturing electronic components, semiconductor components, devices, and systems; power-operated film deposition machines

'addit':5 'chip':31 'coat':88 'coater':57,59,61,64 'compon':22,24,36,38,78,80,93,95 'deliveri':73 'deposit':103 'devic':25,39,81,96 'digit':7,14 'dispens':69 'electron':21,35,77,92 'emboss':11,50 'extrus':56 'film':102 'fluidic':68 'ink':72 'machin':1,30,33,45,54,70,89,104 'machineri':18 'manufactur':20,29,76,91 'mask':9 'name':55 'oper':44,53,67,86,101 'packag':32 'pattern':4,6,13,17 'photo':16 'photo-pattern':15 'power':43,52,66,85,100 'power-oper':42,51,65,84,99 'print':3,8 'semiconductor':23,28,37,79,94 'spin':58,87 'spray':60 'stamp':10,48 'subtract':12 'system':27,41,83,98 'tool':46 'vapor':63

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