Thermal pads for use in heat transfer between a heat source and a heat dissipator for prevention of overheating for use in computers and computer components; Thermally conductive pads, thermally conductive wafers

'compon':26 'comput':23,25 'conduct':28,31 'dissip':15 'heat':6,10,14 'overh':19 'pad':2,29 'prevent':17 'sourc':11 'thermal':1,27,30 'transfer':7 'use':4,21 'wafer':32

Thermal pads for heat sinks for use in electronic devices for transferring heat from a heat source; Computer heat sinks in the form of sheets; heat sinks for use in computers; Heat conductive sheets for cooling processors and video cards

'card':40 'comput':18,31 'conduct':33 'cool':36 'devic':10 'electron':9 'form':23 'heat':4,13,16,19,26,32 'pad':2 'processor':37 'sheet':25,34 'sink':5,20,27 'sourc':17 'thermal':1 'transfer':12 'use':7,29 'video':39

KRYOSHEET

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