LAPLACE

Owners

Goods & Services

Automatic machines, namely, automatic bonding machines with respect to micro periphery; machines, namely, automatic bonding machines, for the application of connecting material on substrates; machines, namely, automatic bonding machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material

Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds

Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds