Integrated circuit packaging repair equipment in the nature of a Ball grid array (BGA) comprised primarily of a linear 3D motion stage for positioning purposes, image processors, PC electrical controller, computer operating software for controlling the array, and heating and cooling elements; measuring equipment for use in measuring solder paste in circuit boards

'3d':20 'array':13,37 'ball':11 'bga':14 'board':53 'circuit':2,52 'compris':15 'comput':31 'control':30,35 'cool':41 'electr':29 'element':42 'equip':5,44 'grid':12 'heat':39 'imag':26 'integr':1 'linear':19 'measur':43,48 'motion':21 'natur':8 'oper':32 'packag':3 'past':50 'pc':28 'posit':24 'primarili':16 'processor':27 'purpos':25 'repair':4 'softwar':33 'solder':49 'stage':22 'use':46

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