U.S. federal trademark · Serial No. 85779168
Semiconductors, Flip-chip bumping, namely, conductive bumps to be applied to the surface of electronic chips to provide an electrical connection, Electronic Chip for the manufacture of integrated circuits, electronic apparatus for testing wafer level, electronic apparatus for testing chip level, electronic integrated circuits for use in the display of LCD TV, OLED TV, PDP, tablet PC, mobile phone
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.