Semiconductor manufacturing machines, namely, semiconductor assembly equipment in the nature of automated die attach equipment, automated die sorting equipment, and automated die bonding equipment; Semiconductor manufacturing machines, namely, flip chip bonding machines, flip chip placement machines, and die attach machines; Semiconductor wafer processing machines; Semiconductor manufacturing machines, namely, electronic assembly manufacturing machines

'assembl':6,50 'attach':14,39 'autom':12,16,21 'bond':23,31 'chip':30,34 'die':13,17,22,38 'electron':49 'equip':7,15,19,24 'flip':29,33 'machin':3,27,32,36,40,44,47,52 'manufactur':2,26,46,51 'name':4,28,48 'natur':10 'placement':35 'process':43 'semiconductor':1,5,25,41,45 'sort':18 'wafer':42

Adhesive tape for industrial and commercial use, namely, adhesive tape for use in the transfer of electronic components in connection with semiconductor assembly equipment

'adhes':1,9 'assembl':23 'commerci':6 'compon':18 'connect':20 'electron':17 'equip':24 'industri':4 'name':8 'semiconductor':22 'tape':2,10 'transfer':15 'use':7,12

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