U.S. federal trademark · Serial No. 79455624
Encapsulation of semiconductors for third parties; semiconductor encapsulation; custom manufacture of semiconductor components, devices and integrated circuits; processing of semiconductor wafers; on-demand production of semiconductor circuits; on-demand production of semiconductor wafers; custom manufacture of chips [integrated circuits] for third parties; on-request assembling of materials for third parties.
Semi-conductors; microchips; integrated circuits; boards for integrated circuits; quantum dots [crystalline semi-conductor materials]; semi-conductor memory units; semiconductor test apparatus; probes for testing semiconductors; computer software for processing semiconductor wafers; computer software for use in integrated circuit design; software for the operation and management of integrated circuit components; quantum computers.
Technical consultancy relating to the development of semiconductors; technical consultancy services relating to the design of semiconductors; design of integrated circuits; design of semiconductor chips; design of optoelectronic apparatus and instruments; design of optical and micro-optical components; development of software for chip design; research in the area of semiconductor processing technology; testing, authentications and quality control.
Retail and/or wholesale services in establishments and via global computer networks for semiconductors; retail and/or wholesale services in establishments and via global computer networks for microchips; retail and/or wholesale services in establishments and via global computer networks for integrated circuits; retail and/or wholesale services in establishments and via global computer networks for semiconductor wafers.
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.