SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; CERDIPS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; PRINTED CIRCUITS, PRINTED WIRING; MULTILAYER PRINTED CIRCUIT BOARDS

'acoust':34 'aluminum':66 'array':58,63 'ball':61 'board':48,52,55,101 'carrier':40 'ceram':70,83 'cerdip':81 'chip':28,39,59,64 'circuit':22,47,51,80,93,95,100 'conductor':5,20,27,45 'crystal':30 'film':14 'filter':36 'flexibl':49 'glaze':6 'grid':57,62 'head':11 'integr':21,79,92 'interpos':41 'leadless':38 'manufactur':77,90 'multilay':15,98 'name':69,82 'nitrid':67 'packag':23,29,37,60,65,71,84 'pin':56 'polyimid':12 'print':46,50,53,94,96,99 'printer':10 'product':68 'reson':31 'saw':32 'semi':4,19,26,44 'semi-conductor':3,18,25,43 'substrat':1,7,16,73,86 'surfac':33 'thermal':9 'thin':13 'use':74,87 'wave':35 'wire':54,97

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