A fully automated, environmentally controlled, wafer handling system, primarily composed of a high-speed robot, control computer, clean air handling unit, and load ports for receiving wafers, designed to support multiple metrology modules for measurement of optical-critical dimensions, registration and overlay, and thin film thickness on wafers in the quality control aspect of the wafer manufacturing process

'air':20 'aspect':55 'autom':3 'clean':19 'compos':10 'comput':18 'control':5,17,54 'critic':40 'design':29 'dimens':41 'environment':4 'film':47 'fulli':2 'handl':7,21 'high':14 'high-spe':13 'load':24 'manufactur':59 'measur':36 'metrolog':33 'modul':34 'multipl':32 'optic':39 'optical-crit':38 'overlay':44 'port':25 'primarili':9 'process':60 'qualiti':53 'receiv':27 'registr':42 'robot':16 'speed':15 'support':31 'system':8 'thick':48 'thin':46 'unit':22 'wafer':6,28,50,58

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