Trademark Search  /  MACDERMID ALPHA ELECTRONICS SOLUTIONS A

MACDERMID ALPHA ELECTRONICS SOLUTIONS A

● Live · Pending

U.S. federal trademark · Serial No. 97528454

Mark
MACDERMID ALPHA ELECTRONICS SOLUTIONS A
Status
Pending
Serial Number
97528454
Filing Date
August 1, 2022
Class(es)
Class 001, Class 003, Class 006, Class 009

Owners

MacDermid, Incorporated
03 · Waterbury, CT, US
MacDermid, Incorporated
03 · Waterbury, CT, US

Goods & Services

Chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating, namely chemical composition for plating metals, non-metals and plastics; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; Chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry

Cleaning agents for metal and non-metal surfaces

metal wire; silver solder; gold solder; brazing alloy; hard solder; metal rod for brazing and welding, including steel titanium alloy; soft solder; solder preforms; Welding metal rod; tin wire

Brazed metal electrode

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.