MACHINES AND TOOLS FOR PRODUCING MICRO-ELECTRONIC ASSEMBLIES OF ONE OR MORE ELECTRONIC COMPONENTS-NAMELY, INNER AND OUTER LEAD BONDING MACHINES; TOOL SLIDE ASSEMBLIES FOR POSITIONING THE WORK; INNER LEAD BONDER TOOLING; MICROVIDEO ALIGNMENT APPARATUS; THERMODES, BONDING TIPS PULSE REFLOW BONDING APPARATUS AND TOOLING; MECHANICAL HANDLING APPARATUS FOR TESTING SEMI-CONDUCTOR DEVICES ON TAPE; ISOLATION PUNCHES; TAPE CODING PUNCHES; BURN-IN FIXTURES; PRECISION TAPE EXCISOR; PUNCH, DIE AND PRESSURE PADS; PRECISION LEAD FORMING TOOLS; PRECISION LEAD FORMING TOOL INSERTS; AND X-Y-0-Z HEATED BASES

'0':88 'align':36 'apparatus':37,44,49 'assembl':9,26 'base':91 'bond':22,39,43 'bonder':33 'burn':64 'burn-in':63 'code':61 'compon':16 'components-nam':15 'conductor':54 'devic':55 'die':71 'electron':8,14 'excisor':69 'fixtur':66 'form':77,81 'handl':48 'heat':90 'inner':18,31 'insert':83 'isol':58 'lead':21,32,76,80 'machin':1,23 'mechan':47 'micro':7 'micro-electron':6 'microvideo':35 'name':17 'one':11 'outer':20 'pad':74 'posit':28 'precis':67,75,79 'pressur':73 'produc':5 'puls':41 'punch':59,62,70 'reflow':42 'semi':53 'semi-conductor':52 'slide':25 'tape':57,60,68 'test':51 'thermod':38 'tip':40 'tool':3,24,34,46,78,82 'work':30 'x':86 'x-i':85 'y':87 'z':89

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