MACHINES AND TOOLS FOR PRODUCING MICRO-ELECTRONIC ASSEMBLIES OF ONE OR MORE ELECTRONIC COMPONENTS-NAMELY, INNER AND OUTER LEAD BONDING MACHINES, TOOL SLIDE ASSEMBLIES FOR POSITIONING THE WORK, INNER LEAD BONDER TOOLING, MICROVIDEO ALIGNMENT APPARATUS, THERMODES, BONDING TIPS PULSE REFLOW BONDING APPARATUS AND TOOLING, MECHANIAL HANDLING APPARATUS FOR TESTING SEMICONDUCTOR DEVICES ON TAPE, ISOLATION PUNCHES, TAPE CODING PUNCHES, BURN-IN FIXTURES, PRECISION TAPE EXCISOR, PUNCH, DIE AND PRESSURE PADS, PRECISION LEAD FORMING TOOLS, PRECISION LEAD FORMING TOOL INSERTS, AND X-Y-0-Z HEATED BASES

'0':86 'align':36 'apparatus':37,44,49 'assembl':9,26 'base':89 'bond':22,39,43 'bonder':33 'burn':62 'burn-in':61 'code':59 'compon':16 'components-nam':15 'devic':53 'die':69 'electron':8,14 'excisor':67 'fixtur':64 'form':75,79 'handl':48 'heat':88 'inner':18,31 'insert':81 'isol':56 'lead':21,32,74,78 'machin':1,23 'mechani':47 'micro':7 'micro-electron':6 'microvideo':35 'name':17 'one':11 'outer':20 'pad':72 'posit':28 'precis':65,73,77 'pressur':71 'produc':5 'puls':41 'punch':57,60,68 'reflow':42 'semiconductor':52 'slide':25 'tape':55,58,66 'test':51 'thermod':38 'tip':40 'tool':3,24,34,46,76,80 'work':30 'x':84 'x-i':83 'y':85 'z':87

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