U.S. federal trademark · Serial No. 73360579 · Reg. No. 1298397
Machines for Assembling Semiconductors-Namely, Wedge Bonders, Hybrid Epoxy Die Mounters and Hybrid Ball Bonders
Equipment for Testing Semiconductors-Namely, Bond Testers and Magnification Units for Optical Inspection
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.