Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, semiconductor packaging for manufacturers of systems and devices utilizing semiconductors in the nature of dies, substrates, interposers, wire bond and solder bumps, semiconductor packaging for manufacturers of circuitized lead frames and semiconductor packaging for manufacturers of circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuit

'board':3,54 'bond':35 'bump':38 'chip':4 'circuit':2,44,53,59,77 'compon':16 'connect':71 'contamin':61 'damag':65 'devic':24 'die':31 'electr':70 'electron':15 'frame':46 'integr':58,76 'interpos':33 'lead':45 'manufactur':11,20,42,51 'mechan':64 'moistur':62 'name':7 'natur':29 'packag':6,9,18,40,49 'print':1 'protect':57 'provid':68 'scale':5 'semiconductor':8,13,17,26,39,48 'solder':37 'substrat':32 'system':22 'use':55 'util':25 'wire':34

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