MLE

Owners

Goods & Services

Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, transistors, and wafers; Semiconductor testing apparatus; Semiconductor wafer testing apparatus; Tensile testing machines; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; Optical inspection apparatus for industrial use; Optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; Electronic apparatus for testing the electrical conductivity of semiconductor wafers; Ultrasonic equipment for testing and inspecting semiconductors; Metal strength testing machines; Probes for testing semiconductors; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; structural parts and equipment for the aforesaid machines and apparatus, namely, batteries, electric wires and cables, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus included in this class

Technical consultancy for others featuring methods and devices for research and design in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development for others via contract featuring research and development methods and devices in the field of semiconductor technology; technical system engineering consultation services for others featuring engineering methods and devices in the field of semiconductor technology

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; Structural machine parts and equipment, namely, fittings in the nature of coupling for machines, bearings, chucks, joints and lubricating apparatus; Machines for manufacturing semiconductors; Semiconductor wafer processing machines; Semiconductor wafer processing equipment; Embossing printing machines