MODULAR AI FACTORY

Owner

Goods & Services

Direct-to-chip cooling systems for high-performance computing (HPC) systems,namely, heat sinks, liquid cooling systems consisting of fluid lines, pumps, andwater chillers, and air cooling systems consisting of air ducts, fans, and heatexchangers; Liquid immersion cooling systems designed to cool computercomponents used in high-performance computing (HPC) operations, consistingof liquid baths, liquid pumps, and air-cooled heat exchangers

Prefabricated building for housing computer servers and computer components used inhigh-performance computing (HPC) operations, made substantially of metal

Electric power distribution units (PDUs), namely, smart PDUs; Power distribution systemfor modular computer components for use in high-performance computing (HPC)operations; Power distribution system consisting of electric cables, electric currentswitches, electric breakers, electric control panel; electric relays; electric connectors; electric connector housings; electric transformers