Die bonders used in manufacturing electronic components; machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; adhesive chemical dispensing machines; high precision dispense and assembly equipment for the semiconductor, advanced packaging and microelectronics industry; laser doping, laser scribing and laser disk texturing machines

'adhes':19 'advanc':32 'assembl':27 'bonder':2 'chemic':20 'chip':13 'compon':7,15,18 'die':1 'disk':43 'dispens':21,25 'dope':38 'electron':6,17 'equip':28 'high':23 'industri':36 'laser':37,39,42 'machin':8,22,45 'manufactur':5 'microchip':11 'microelectron':35 'mount':10 'packag':33 'precis':24 'scribe':40 'semiconductor':12,14,31 'textur':44 'use':3

MRSI

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