variable electronic test assemblies with data handling, sensors and measuring instruments that can be connected to them, for measurement of layer thicknesses in the range of monolayers up to 10 cm by use of magnetic induction methods or eddy current methods or beta-ray back-scattering methods, for measurement of conductivity of nonferrous metals by means of phase angle measurements, with and without use of a temperature sensor, for measurement of copper layer thicknesses in through-platings of circuit boards, and for determination of ferrite content

'10':30 'angl':61 'assembl':4 'back':47 'back-scatt':46 'beta':44 'beta-ray':43 'board':83 'circuit':82 'cm':31 'conduct':53 'connect':15 'content':89 'copper':74 'current':40 'data':6 'determin':86 'eddi':39 'electron':2 'ferrit':88 'handl':7 'induct':36 'instrument':11 'layer':21,75 'magnet':35 'mean':58 'measur':10,19,51,62,72 'metal':56 'method':37,41,49 'monolay':27 'nonferr':55 'phase':60 'plate':80 'rang':25 'ray':45 'scatter':48 'sensor':8,70 'temperatur':69 'test':3 'thick':22,76 'through-plat':78 'use':33,66 'variabl':1 'without':65

MULTI 1000 S

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