Trademark Search  /  MULTI-DIE-INTEGRATION ALLIANCE

MULTI-DIE-INTEGRATION ALLIANCE

● Live · Registered

U.S. federal trademark · Serial No. 98088753 · Reg. No. UK00003933309

Mark
MULTI-DIE-INTEGRATION ALLIANCE
Status
Registered
Serial Number
98088753
Registration No.
UK00003933309
Filing Date
July 13, 2023
Registration Date
October 13, 2023
Class(es)
Class 009, Class 040, Class 042

Owners

Samsung Electronics Co., Ltd.
03 · Suwon-si, Gyeonggi-do, KR
Samsung Electronics Co., Ltd.
03 · Suwon-si, Gyeonggi-do, KR

Goods & Services

Design of semiconductors; design of semiconductors and integrated circuits; product research, custom design and testing for new product development in the field of semiconductors; technical research in the field of semiconductor design; technical research in the field of semiconductor manufacturing; design of semiconductor chips; quality control services by tracking of semiconductor devices

Semiconductor foundry services being metal casting for semiconductors; semiconductor foundry services being the custom manufacture of semiconductor wafers; processing of semiconductors being the custom manufacture of semiconductors; custom manufacturing and assembling services relating to semi-conductor parts and integrated circuits; semiconductor and integrated circuit foundry services, namely, custom manufacture of semiconductors and integrated circuits; custom manufacturing services in the nature of processing of integrated circuits being the custom manufacture of integrated circuits; custom manufacturing services in the nature of processing of semiconductor elements being the custom manufacture of semiconductor components; custom manufacturing services in the nature of processing of semiconductor wafers being the custom manufacture of semiconductor wafers; custom manufacture of semiconductor wafers; processing of semiconductor equipment and parts being the custom manufacture of semiconductor components; processing and assembly of semiconductors being the custom manufacture of semiconductors; processing of parts for semiconductor manufacturing being the custom manufacture of semiconductor; custom assembling of circuit board and semiconductor

Semiconductors; optical semiconductors; semiconductor devices; semiconductor component, namely, chips and lead frames; semiconductor components, namely, transistors and diodes; semiconductor component, namely, semiconductor chips; semiconductor components, namely, luminous element packages; semiconductor elements, namely, chips and lead frames; semiconductor elements, namely, wafers, chips, substrates, optical amplifiers, testing apparatus, power elements, chip housings; semiconductor wafers; electronic semiconductors; integrated circuits; chips, namely, integrated circuits; wafers for integrated circuits; solid state drives; semiconductor memories

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.